产品描述
Gold OSP 0.2mm thickness PCB seamless splicing
Multilayer PCB, seamless splicing PCB
1) Thickness: 0.1mm-5mm
2) Minimum linewidth:0.075mm/3mil
3) Minimum gap:0.065/2.8mil
4) Minimum aperture inradium:0.15mm
5) Minimum aperture external diameter:0.45mm
6) Minimum BGA: 0.2mm
7) Layer:4 layers through hole non-impedance
All multilayer boards are printed with 36t screen, the resistance welding oil is 50 tons thicker than the traditional 43t, which provides reliability guarantee for the bga and more precise fine lines.
More information you can views here
- Multilayer PCB
- seamless splicing PCB
产能:
80000
运输时间表:
30天内
Incoterms:
未通知包装明细:
Customer settings
更多关于
HK CT TECH CO.,LIMITED
100-200
员工
50M - 100M
销售额(美元)
100%
% 出口销售额
Year
成立年份
业务类型
- Industry / Manufacturer
关键词
- Multilayer PCB
联系方式和位置
- Edward Deng
- +86 186 xxxxxxxx
- Shenzhen / Guangdong | 中国