Honghu (Suzhou) Semiconductor Technology Co.，Ltd

Honghu atmospheric transfer module introduction
Single-arm/double-arm construction, reversible, available on demand ;
The interpolation algorithm supports VIA (Inflection point) and supports multiple FOUPs ;
Full axis AC servo motor, 23bits absolute encoder ;
S-curve acceleration and deceleration motion control technology, to achieve high-speed, high-precision handling ;
General wafer fixing methods: vacuum adsorption, edge clamping;
Cleanliness level: ISO Class1;
Finger material: carbon fiber, aluminum alloy, high purity ceramics and other options;
According to the wafer material characteristics, the optimal holding scheme is designed and provided