产品描述
Features
Specifications
Welding Method: Laser Solder Ball WeldingMachine Structure: Vertical, Fully Enclosed CabinetAutomation Level: Automated / In-line CapableInstallation Mode: Standalone Or In-line IntegrationSolder Ball Diameter Range: 70 μm – 2.0 Mm (Configurable)Welding Process: Non-contact Laser SolderingProcess Stability: High Repeatability And ConsistencyPositioning Method: Vision-guided Precision Alignment
Product Overview
The Vertical Solder Ball Welding Machine is a fully enclosed, high-precision laser soldering system designed for automated solder ball attachment in advanced electronic manufacturing. With a vertical cabinet structure, integrated vision system, and in-line workflow capability, the machine ensures stable process control, high repeatability, and a clean operating environment.
The system is suitable for mass production scenarios requiring high reliability, safety, and consistency, such as semiconductor packaging and precision microelectronics assembly.
Key Features
Vertical Enclosed Structure
Full cabinet design improves safety, process stability, and environmental control.
Vision-Guided Solder Ball Welding
Integrated vision system enables accurate positioning and real-time alignment correction.
Laser Soldering Technology
Non-contact laser welding ensures precise energy control and consistent solder joint quality.
FFU Clean Air Unit (Optional)
Supports cleanroom-compatible operation and reduces particle contamination.
In-Line Workflow Capability
Designed to support production line integration for automated, continuous operation.
Industrial Control System
Built-in industrial PC with intuitive HMI for recipe management and process monitoring.
Status Indicator Tower Light
Three-color signal light provides real-time machine status indication.
Vertical Solder Ball Welding Machine| Enclosed Laser System vision system soldering technology soldering system vertical cabinet 0
Vertical Solder Ball Welding Machine| Enclosed Laser System vision system soldering technology soldering system vertical cabinet 1
Typical Applications
Semiconductor packaging
IC and chip-level solder ball attachment
Microelectronics and sensor assembly
Automated high-volume soldering production
Notes
System configuration, laser source, vision modules, automation interfaces, and specifications can be customized according to customer requirements. If you need to obtain detailed information, please contact Xiamen Large Automation Technology Co,.Ltd.
- 植锡球机
- 垂直焊球机
产能:
10000
运输时间表:
30天内
Incoterms:
CFR - Cost and Freight
CIF - Cost, Insurance and Freight
包装明细:
TBA
更多关于
Xiamen Large Automation Technology Co,.Ltd.
200-500
员工
50M - 100M
销售额(美元)
50%
% 出口销售额
Year
成立年份
业务类型
- Industry / Manufacturer
关键词
- 智能点胶设备
- 水胶贴合设备
- 激光锡球焊接设备
联系方式和位置
-
Anna ********
-
+86 8********
-
Xia Men / 福建 (Fujian) | 中国